NXP | MODULAR EVENT KIT
NXP | MODULAR EVENT KIT
NXP | MODULAR EVENT KIT
NXP | MODULAR EVENT KIT
NXP | MODULAR EVENT KIT
NXP | MODULAR EVENT KIT

DETAILS

clientNXP

partnerGoDev, von Salmuth Ingenieure


Needs analysis, concept development, and design of a modular architectural framing system, including the development of custom extruded aluminum profiles capable of supporting heavy loads at any position along the structure. The project included the design of a tool-free connection system, integrated cable management, and flexible mounting solutions for keder banners and lighting. SOLIDSENSE also handled fabrication and final assembly, as well as the architectural planning and design of the system for NXP's major trade show appearances.